Robotic Deployment in Wireless Sensor Networks

Dr. Dan Popa

Assistant Professor, Electrical Engineering Department

University of Texas, Arlington

Tuesday, February 28th, 2006, 3:30-4:30pm

113 Jerry Junkins Building

Abstract

Wireless communication has been traditionally used in robotics to transmit sensory and telemetry information between a robot and a base station.

Because research in mobile robotics has typically focused on navigation, mapping and sensor fusion, network oriented problems such as communication bandwidth optimization, coverage and fault tolerance are not usually considered in this context. Recently, due to a dramatic reduction in the cost of wireless devices, on-board sensing and computation, it is possible to envision deployment scenarios where large numbers of inexpensive mobile robots are used as wireless sensor platforms. The motivation behind this research is formulating and solving combined robot navigation issues (such as obstacle avoidance, environment mapping and coverage) with sensor network issues (such as congestion control, routing and node energy minimization).

We present several types of algorithms for mobile wireless sensor nodes (MWSN) as well as experimental results with a fleet of mobile robots and sensors in our lab. The algorithms include adaptive sampling (AS) for distributed field estimation, potential fields (PF) for communication bandwidth optimization, and a discrete event controller (DEC) for mission planning.

 

Biography: 

Dan Popa received his B.A. and M.S. degrees in 1993 and 1994, respectively, from Dartmouth College. He received his Ph.D. in Electrical Engineering at Rensselaer Polytechnic Institute in 1998.  Between 1998 and 2004, he was part of the technical staff at the Center for Automation Technologies (CAT) at RPI as a research scientist.  He joined The University of Texas Arlington in September 2004 as an assistant professor with the Electrical Engineering Department and the Automation and Robotics Research Institute. Dr. Popa's research focuses on microrobotics, 3D wafer level packaging, and the robotic deployment of sensor networks using autonomous  robots.

 

 

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